市场概况

Polyimide (PI), a polymer of imide monomers, has been in mass production since 1955. Renowned for its exceptional heat resistance, polyimides find diverse applications in industries that demand rugged organic materials capable of withstanding high temperatures. 尤其, polyimide film stands out for its unparalleled thermal properties, boasting a lack of melting point and the ability to function across an extensive temperature range from -269°C to 350°C. This remarkable attribute positions polyimide films as the top choice for applications requiring robust thermal performance.

In addition to its exceptional thermal properties, polyimide films exhibit outstanding mechanical, 电气, temperature, 和耐化学性, making them optimal for a wide array of industries, including aerospace, 汽车, 电气, and electronic sectors. The aerospace industry, in particular, leverages polyimide films extensively due to their high heat resistance, electrical insulation capabilities, and exceptional strength. These films play a crucial role in wire insulation and are utilized in electric motors operating in harsh temperature environments, where effective heat and electricity management are paramount concerns.

The global polyimide film market is poised for substantial growth, 预计复合年增长率 (复合年增长率) 超过 6.6% and an incremental growth of USD 0.7 billion during the forecast period spanning 2023 到 2029. This growth trajectory is attributed to the escalating demand for consumer electronics, including modern computers, LEDs, mobile devices, and other electronic gadgets. The proliferation of these electronics is expected to be a key driver for the polyimide films industry, as these films are integral components in the production of electronic devices, providing essential thermal and electrical insulation.

市场细分

该行业报告提供了全球市场的市场估计和预测, 其次是对产品类型的详细分析, 应用, 最终用户, 和地区.
产品类别: thermoplastic PI, thermoset PI
应用: flexible printed circuit, motor and generator, pressure sensitive tape, specialty fabricated product, wire and cable
最终用户: 航天, 汽车, 电气和电子, labelling, 其他的
地区: 亚太, 欧洲, 北美, 中东和非洲 (事物), 南美洲

Examining product applications, flexible printed circuits (FPCs) accounted for the largest share of over 46.3% in the polyimide films market in 2022. This segment is poised to grow at the fastest pace over the forecast period as well, fueled by surging electronics and automobile electrification trends that boost FPC uptake.

Polyimide film provides the ideal substrate for manufacturing flexible printed circuit boards and connectors. Its key advantages include heat resistance, chemical stability and mechanical strength to withstand bending. As devices get more compact, flexible circuits enable configuration into tight spaces where rigid boards would prove unviable. FPCs are thus increasingly adopted across smartphones, wearables, 医用器材, automotive dashboards and industrial electronics.

而且, continuous technology advances allow fabricating more complex flexible circuits at higher densities to accommodate intricate component layouts. The rising need for miniaturization and reliability in consumer and industrial devices will thereby drive polyimide demand from the thriving flexible circuits industry.

In terms of regional markets, Asia Pacific held the dominant 46.8% industry share in 2022, followed by Europe and North America. Asia Pacific will maintain market leadership over the coming years fueled by high concentration of device manufacturing coupled with a booming automotive sector.

Within Asia Pacific, China and South Korea present major opportunities as manufacturing hubs for electronics and electric vehicles where polyimide films find extensive application. Europe and North America also represent mature markets focused on cutting-edge niche applications in aerospace, healthcare and renewables where performance requirements for polyimide films remain stringent.

主要公司及竞争格局

The report also provides a detailed analysis of several leading polyimide film market vendors that include Arakawa Chemical Industries, 有限公司, 圣戈班公司, 杜邦德内穆尔, 公司, FLEXcon Company, 公司, Guilin Electrical Equipment Scientific Research Institute Co., 有限公司. (GLESI), I.S.T Corporation, Jiangyin Yunda Electronics New Material Co., 有限公司, Kaneka Corporation, Liyang Huajing Electronic Material Co., 有限公司, PI Advanced Materials Co., 有限公司, Shandong Wanda Micro-electronic Material Co., 有限公司, Shenzhen Rayitek Hi-tech Film Co., 有限公司, Suzhou Kying Industrial Materials Co., 有限公司, Taimide Tech. 公司, Toyobo Co., 有限公司, 宇部兴产株式会社, Wuxi Goto New Material Co., 有限公司, 除其他外. 在这份报告中, 全面分析关键参与者及其策略，以了解市场的竞争前景.

报告范围

To analyze and forecast the market size of the global polyimide film market.
To classify and forecast the global polyimide film market based on product type, 应用, 最终用户, 地区.
To identify drivers and challenges for the global polyimide film market.
检查合并等竞争性发展 & 收购, 协议, 合作与伙伴关系, ETC。, in the global polyimide film market.
To identify and analyze the profile of leading players operating in the global polyimide film market.

为什么选择这份报告

Gain a reliable outlook of the global polyimide film market forecasts from 2023 到 2029 跨场景.
确定投资的增长领域.
通过公司简介和市场数据领先于竞争对手.
Excel 格式的跨场景分析易用性的市场预估.
三个月的战略咨询和研究支持.
为单用户许可证提供打印验证.