市場概況

Polyimide (PI), a polymer of imide monomers, has been in mass production since 1955. Renowned for its exceptional heat resistance, polyimides find diverse applications in industries that demand rugged organic materials capable of withstanding high temperatures. Notably, polyimide film stands out for its unparalleled thermal properties, boasting a lack of melting point and the ability to function across an extensive temperature range from -269°C to 350°C. This remarkable attribute positions polyimide films as the top choice for applications requiring robust thermal performance.

In addition to its exceptional thermal properties, polyimide films exhibit outstanding mechanical, 電気, 温度, and chemical resistance, making them optimal for a wide array of industries, including aerospace, 自動車, 電気, and electronic sectors. The aerospace industry, in particular, leverages polyimide films extensively due to their high heat resistance, electrical insulation capabilities, and exceptional strength. These films play a crucial role in wire insulation and are utilized in electric motors operating in harsh temperature environments, where effective heat and electricity management are paramount concerns.

The global polyimide film market is poised for substantial growth, 予測される年間複利成長率 (CAGR) of over 6.6% and an incremental growth of USD 0.7 billion during the forecast period spanning 2023 に 2029. This growth trajectory is attributed to the escalating demand for consumer electronics, including modern computers, LEDs, mobile devices, and other electronic gadgets. The proliferation of these electronics is expected to be a key driver for the polyimide films industry, as these films are integral components in the production of electronic devices, providing essential thermal and electrical insulation.

市場セグメンテーション

この業界レポートは、世界市場の市場推定と予測を提供します。, 続いて製品タイプの詳細な分析, 応用, エンドユーザー, と地域.
Product type: thermoplastic PI, thermoset PI
応用: flexible printed circuit, motor and generator, pressure sensitive tape, specialty fabricated product, wire and cable
エンドユーザー: 航空宇宙, 自動車, electrical and electronics, labelling, その他
領域: アジア太平洋地域, ヨーロッパ, 北米, 中東とアフリカ (もの), 南アメリカ

Examining product applications, flexible printed circuits (FPCs) accounted for the largest share of over 46.3% in the polyimide films market in 2022. This segment is poised to grow at the fastest pace over the forecast period as well, fueled by surging electronics and automobile electrification trends that boost FPC uptake.

Polyimide film provides the ideal substrate for manufacturing flexible printed circuit boards and connectors. Its key advantages include heat resistance, chemical stability and mechanical strength to withstand bending. As devices get more compact, flexible circuits enable configuration into tight spaces where rigid boards would prove unviable. FPCs are thus increasingly adopted across smartphones, wearables, medical equipment, automotive dashboards and industrial electronics.

さらに, continuous technology advances allow fabricating more complex flexible circuits at higher densities to accommodate intricate component layouts. The rising need for miniaturization and reliability in consumer and industrial devices will thereby drive polyimide demand from the thriving flexible circuits industry.

In terms of regional markets, Asia Pacific held the dominant 46.8% industry share in 2022, followed by Europe and North America. Asia Pacific will maintain market leadership over the coming years fueled by high concentration of device manufacturing coupled with a booming automotive sector.

Within Asia Pacific, China and South Korea present major opportunities as manufacturing hubs for electronics and electric vehicles where polyimide films find extensive application. Europe and North America also represent mature markets focused on cutting-edge niche applications in aerospace, healthcare and renewables where performance requirements for polyimide films remain stringent.

主要企業と競争環境

The report also provides a detailed analysis of several leading polyimide film market vendors that include Arakawa Chemical Industries, 株式会社, Compagnie de Saint-Gobain S.A., デュポン ド ヌムール, 株式会社, FLEXcon Company, 株式会社, Guilin Electrical Equipment Scientific Research Institute Co., 株式会社. (GLESI), I.S.T Corporation, Jiangyin Yunda Electronics New Material Co., 株式会社, Kaneka Corporation, Liyang Huajing Electronic Material Co., 株式会社, PI Advanced Materials Co., 株式会社, Shandong Wanda Micro-electronic Material Co., 株式会社, Shenzhen Rayitek Hi-tech Film Co., 株式会社, Suzhou Kying Industrial Materials Co., 株式会社, Taimide Tech. 株式会社, Toyobo Co., 株式会社, UBE Corporation, Wuxi Goto New Material Co., 株式会社, とりわけ. このレポートでは, 市場の競争見通しを理解するために、主要なプレーヤーとその戦略を徹底的に分析します。.

報告書の範囲

To analyze and forecast the market size of the global polyimide film market.
To classify and forecast the global polyimide film market based on product type, 応用, エンドユーザー, 領域.
To identify drivers and challenges for the global polyimide film market.
合併などの競争展開を検討するため & 買収, 協定, コラボレーションとパートナーシップ, 等, in the global polyimide film market.
To identify and analyze the profile of leading players operating in the global polyimide film market.

このレポートを選択する理由

Gain a reliable outlook of the global polyimide film market forecasts from 2023 に 2029 シナリオ全体にわたって.
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