Global IO Link System Market

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产品代码: GT03089R 行业: 地区:

The global IO link system market is projected to rise by USD 19 十亿 2028, 根据 Gen Consulting 公司的一份新报告. It is anticipated to expand at a CAGR of 23.4 预测期内的百分比.

该报告提供了有关当前全球市场情况的深入分析和见解, latest trends and drivers into global IO link system market. 它提供了对市场规模等各种细节的独家见解, 主要趋势, 竞争格局, 增长率和细分市场. This study also provides an analysis of the impact of the COVID-19 crisis on the IO link system industry.

该行业报告提供了全球市场的市场估计和预测, followed by a detailed analysis of the component, 应用, 行业, 和地区. The global market for IO link system can be segmented by component: IO-Link devices, IO-Link masters. The IO-Link devices segment held the largest revenue share in 2021. IO link system market is further segmented by application: handling and assembly automation, intralogistics, machine tools, packaging. 在这些当中, the handling and assembly automation segment was accounted for the highest revenue generator in 2021. Based on industry, the IO link system market is segmented into: discrete manufacturing, process manufacturing. The discrete manufacturing segment captured the largest share of the market in 2021. 根据地区, the IO link system market also can be divided into: 亚太地区, 欧洲, 北美, 世界其他地区 (排). 据研究, Europe had the largest share in the global IO link system market.

By component:
IO-Link devices
IO-Link masters

按申请:
handling and assembly automation
intralogistics
machine tools
packaging

By industry:
discrete manufacturing
process manufacturing

按地区:
– 亚太地区
– 欧洲
– 北美
– 世界其他地区 (排)

The report has also analysed the competitive landscape of the global IO link system market with some of the key players being Balluff GmbH, Banner Engineering Corp., Datalogic S.p.A., Festo Corporation, Hans Turck GmbH & 钴. 公斤, ifm electronic GmbH, Omron Corp., Pepperl+Fuchs SE, Rockwell Automation, 公司, Sick AG, Siemens AG, 除其他外.
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历史 & 预测期
本研究报告对各个细分市场进行了分析 2018 到 2028 考虑到 2021 为基准年.

报告范围
To analyze and forecast the market size of the global IO link system market.
To classify and forecast the global IO link system market based on component, 应用, 行业, 地区.
To identify drivers and challenges for the global IO link system market.
– 检查合并等竞争性发展 & 收购, 协议, 合作与伙伴关系, ETC。, in the global IO link system market.
To identify and analyze the profile of leading players operating in the global IO link system market.

为什么选择这份报告
Gain a reliable outlook of the global IO link system market forecasts from 2022 到 2028 跨场景.
– 确定投资的增长领域.
– 通过公司简介和市场数据领先于竞争对手.
– Excel 格式的跨场景分析易用性的市场预估.
– 三个月的战略咨询和研究支持.
– 为单用户许可证提供打印验证.

Global IO Link System Market

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Global IO Link System Market - 报告范围
报告属性

细节

基准年

2021

预测年份

2022-2028

复合年增长率 (2022-2028)

23.4%

页数

87

行业参与者

Balluff GmbH, Banner Engineering Corp., Datalogic S.p.A., Festo Corporation, Hans Turck GmbH & 钴. 公斤, ifm electronic GmbH, Omron Corp., Pepperl+Fuchs SE, Rockwell Automation Inc., Sick AG, Siemens AG

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