The global thin wafer processing and dicing equipment market size is projected to grow by USD 272.0 百万来自 2022 到 2028, 复合年增长率为 6.3 百分, 根据 Gen Consulting 公司的一份新报告.

该报告涵盖了市场规模和增长, 分割, 区域细分, 竞争格局, trends and strategies for global thin wafer processing and dicing equipment market. 它追踪市场的历史和预测市场增长. 该报告根据市场趋势和主要竞争对手的方法确定了最重要的机会和战略细分市场. This study also provides an analysis of the impact of the COVID-19 crisis on the thin wafer processing and dicing equipment industry.

该行业报告提供了全球市场的市场估计和预测, 其次是类型的详细分析, wafer size, 应用, 和地区. The global market for thin wafer processing and dicing equipment can be segmented by type: thinning equipment, dicing equipment. The thinning equipment segment captured the largest share of the market in 2021. Thin wafer processing and dicing equipment market is further segmented by wafer size: 少于 4 英寸, 5 inch and 6 英寸, 8 英寸, 12 英寸. 这 8 inch segment held the largest share of the global thin wafer processing and dicing equipment market in 2021 预计在预测期内将持有其份额. 根据应用, the thin wafer processing and dicing equipment market is segmented into: memory and logic, MEMS device, power device, CMOS image sensor, RFID. 在 2021, the CMOS image sensor segment made up the largest share of revenue generated by the thin wafer processing and dicing equipment market. 根据地区, the thin wafer processing and dicing equipment market also can be divided into: 北美, 欧洲, 亚太, 事物 (中东和非洲), 拉美.

The dicing equipment market is further segmented into blade dicing, laser ablation, stealth dicing, plasma dicing. 据研究, the blade dicing segment had the largest share in the global thin wafer processing and dicing equipment market.

市场细分
按类型: thinning equipment, dicing equipment
By wafer size: 少于 4 英寸, 5 inch and 6 英寸, 8 英寸, 12 英寸
按申请: memory and logic, MEMS device, power device, CMOS image sensor, RFID
按地区: 北美, 欧洲, 亚太, 事物 (中东和非洲), 拉美

The global thin wafer processing and dicing equipment market report offers detailed information on several market vendors, including ASMPT Ltd, Disco Corporation, Han’s Laser Technology Co., 有限公司, KLA Corporation, Neon Tech Co., 有限公司, 松下公司, Suzhou Delphi Laser Co., 有限公司, Tokyo Seimitsu Co., 有限公司, 除其他外.
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历史 & 预测期
本研究报告对各个细分市场进行了分析 2018 到 2028 考虑到 2021 为基准年.

报告范围
– To analyze and forecast the market size of the global thin wafer processing and dicing equipment market.
– To classify and forecast the global thin wafer processing and dicing equipment market based on type, wafer size, 应用, 地区.
– To identify drivers and challenges for the global thin wafer processing and dicing equipment market.
– 检查合并等竞争性发展 & 收购, 协议, 合作与伙伴关系, ETC。, in the global thin wafer processing and dicing equipment market.
– To identify and analyze the profile of leading players operating in the global thin wafer processing and dicing equipment market.

为什么选择这份报告
– Gain a reliable outlook of the global thin wafer processing and dicing equipment market forecasts from 2022 到 2028 跨场景.
– 确定投资的增长领域.
– 通过公司简介和市场数据领先于竞争对手.
– Excel 格式的跨场景分析易用性的市场预估.
– 三个月的战略咨询和研究支持.
– 为单用户许可证提供打印验证.