市場概況

The Semiconductor Bonding Equipment Market is poised for significant growth, with a projected increase from USD 482.9 百万で 2022 米ドルへ 917.9 百万までに 2029, reflecting a notable compound annual growth rate (CAGR) の 9.2% 予測期間中. This market encompasses a range of bonding techniques and equipment types, including Permanent bonding, temporary bonding, and hybrid bonding.

The semiconductor industry has experienced a profound impact from the proliferation of digitalization and the increasing demand for 5G deployment. These factors have propelled the industry towards becoming a trillion-dollar market by 2030. Notably, 中国, as a major consumer and producer of consumer electronics, plays a vital role in shaping the global semiconductor bonding equipment market.

The outbreak of the COVID-19 pandemic has further accelerated the demand for computing devices, which, in turn, has driven the need for semiconductor bonding equipment. しかし, it is important to note that the choice of bonding process employed can significantly impact the cost of ownership and potentially limit the overall market growth.

市場セグメンテーション

市場はさまざまな要因に基づいて分割されます, including type, 応用, そして地理.

Segmentation by Type
Hybrid Bonding Equipment
Permanent Bonding Equipment
Temporary Bonding Equipment

Segmentation by Application
Advanced Packaging
CMOS Image Sensors (CIS)
Engineered Substrates
MEMS Sensors and Actuators
Photonic Devices
Power IC and Power Discrete

地理によるセグメンテーション
北米
アジア太平洋地域
ヨーロッパ
世界のその他の地域

の 2022, the Permanent Bonding Equipment segment held a market share of 68.7%, while the Hybrid Bonding Equipment segment is expected to grow at a CAGR of 24.5% 予測期間中. 同様に, the Power IC & Power Discrete segment dominated with a share of 43.4% で 2022, while the Engineered Substrates segment is projected to experience a CAGR of 13.5%. The market’s expansion is driven by the demand for high-energy and power-efficient devices, wireless and portable electronic products, and the shift towards electrification in the automotive industry. Efficient power management and advancements in Power-over-Ethernet (PoE) standards contribute to the growth of the power IC and discrete segment. Wearable devices, the use of semiconductors with larger mobility and higher critical breakdown fields, and the integration of discrete semiconductors in power adapters for smartphone transmission speeds further drive market growth. The rise of IoT applications and the expansion of 5G networks are expected to boost the adoption of discrete semiconductors globally.

の 2022, the Asia-Pacific region held the largest market share of 82.3% and is expected to achieve the highest compound annual growth rate (CAGR) の 9.3% during the projected period. This growth can be attributed to strategic investments made by significant domestic suppliers and the presence of a well-established semiconductor sector in the region. Specifically, China is predicted to surpass the United States as a dominant player in the semiconductor industry due to its growing demand for domestic chips.

競争環境

The Semiconductor Bonding Equipment Market is fragmented, with key players including ASMPT Ltd., BE Semiconductor Industries N.V., DIAS Automation (HK) 株式会社, 博士. Tresky AG, EV Group GmbH, Fasford Technology Co. 株式会社. (Fuji Corporation), Kulicke and Soffa Industries Inc., MRSI Systems LLC (Mycronic AB), Palomar Technologies Inc., パナソニックホールディングス株式会社, Shibaura Mechatronics Corporation, SUSS MicroTec SE, Tokyo Electron Limited, West Bond Inc. These participants employ tactics such as partnerships, innovation, 投資, and acquisitions to enhance their product offerings and gain a competitive edge.

最近の業界の発展

SÜSS MicroTec SE introduced Impulse Current Bonding in November 2022, a groundbreaking advancement in semiconductor bonding technology. Developed by a Swiss university spin-off, this Sy&Se technology offers robustness similar to anodic bonding and material versatility found in other bonding methods. It will be available on manual and automatic wafer bonder systems.

BE Semiconductor Industries NV announced plans in October 2022 to establish a cutting-edge semiconductor assembly and testing facility in Penang. The facility, comprising Plants 4 と 5, will cover 982,000 square feet in the Bayan Lepas Free Industrial Zone. Scheduled for completion in 2025, this project has the potential to create 2,700 jobs and contribute to economic growth and technological advancement.

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