根据 Gen Consulting 公司发布的市场研究报告, the market size of the global fan out packaging sector is expected to rise by USD 2.7 亿，复合年增长率为 17.2% 到年底 2028.

该行业报告提供了全球市场的市场预测, 其次是类型的详细分析, carrier type, 商业模式, 和地区. The global market data on fan out packaging can be segmented by type: core-fan out, high-density fan out, ultra high-density fan out. 在这些当中, the high-density fan out segment was accounted for the highest revenue generator in 2021. Fan out packaging market is further segmented by carrier type: 200 mm, 300 mm, Panel. 这 300 mm segment is estimated to account for the largest share of the global fan out packaging market. Based on business model, the fan out packaging market is segmented into: foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT). The foundry segment held the largest share of the global fan out packaging market in 2021 预计在预测期内将持有其份额. 根据地区, the fan out packaging market also can be divided into: 中国, 欧洲, 日本, 韩国, 台湾, 美国. 在 2021, Taiwan made up the largest share of revenue generated by the fan out packaging market.

The global fan out packaging market is highly competitive. Key companies profiled in the report include Amkor Technology Inc., ASE Inc., JCET Group, Nepes Corporation, Powertech Technology Inc., 三星电子公司. 有限公司, 台积电股份有限公司.

以数据为中心的报告重点关注市场趋势, 各细分市场的现状和前景. 对主要地区进行全面的市场评估, 该报告对于现有参与者来说是宝贵的资产, 新进入者和未来投资者.

为什么购买这份报告?
– Get a detailed picture of the Global Fan Out Packaging Market
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